| name | thermal-stress |
| description | Thermal stress analysis — constrained expansion, bi-metallic strips, composite bars, thermal fatigue, creep at temperature, thermal shock resistance, CTE mismatch in assemblies. |
| metadata | {"priority":7,"promptSignals":{"phrases":["thermal stress","thermal expansion","CTE","temperature stress","thermal fatigue","bimetallic","constrained expansion"],"minScore":4}} |
Thermal Stress Analysis — Complete Skill
Free Thermal Expansion (Unconstrained)
ΔL = α × ΔT × L [m or in]
ε_T = α × ΔT (thermal strain, no stress produced)
Coefficients of thermal expansion α [10⁻⁶/°C]:
| Material | α |
|---|
| Carbon steel | 11.7 |
| Stainless 304 | 17.3 |
| Stainless 316 | 16.0 |
| Aluminum 6061 | 23.6 |
| Copper | 17.0 |
| Titanium | 8.9 |
| Inconel 718 | 13.0 |
| Brass | 19.0 |
| Concrete | 10-12 |
| Glass (borosilicate) | 3.3 |
| PTFE | 130 |
| CFRP (fiber direction) | -0.5 to +1 |
Constrained Thermal Stress
Fully constrained (both ends fixed):
ε_total = ε_thermal + ε_mechanical = 0
α × ΔT + σ/E = 0
σ = -E × α × ΔT (compressive if heated, tensile if cooled)
Partially constrained:
δ_allowed = some prescribed deformation δ₀
σ = E × (α × ΔT - δ₀/L)
Design check: |σ| < Sy (no yielding at operating temperature)
Remember: Sy decreases with temperature — use elevated temperature Sy
Composite (Multi-Material) Bar
Example: steel rod in aluminum jacket (parallel configuration)
Compatibility: δ_steel = δ_Al (same total deformation)
Equilibrium: P_steel + P_Al = P_external (or = 0 if no external load)
With temperature change ΔT:
P_Al × L/(A_Al × E_Al) + P_steel × L/(A_steel × E_steel) = (α_Al - α_steel) × ΔT × L
Stress in each: σ_i = P_i/A_i
For multiple materials in series:
Forces equal (P₁ = P₂ = P = total force)
Deformations add: δ_total = Σ P×L_i/(A_i×E_i)
Bimetallic Strip (Thermostat)
Curvature induced by CTE mismatch:
κ = 6(α₂-α₁)ΔT(1+m)² / [h(3(1+m)²+(1+mn)(m²+1/mn))]
Where: m = t₁/t₂ (thickness ratio), n = E₁/E₂ (modulus ratio), h = total thickness
Tip deflection (cantilever bimetallic strip, length L):
δ_tip = κ × L²/2
Curvature simplification (m≈1, n≈1):
κ ≈ (α₂-α₁)ΔT × 6/h² (for equal thickness strips)
Thermal Fatigue
Cyclic ΔT → cyclic σ_thermal = E × α × ΔT (if constrained)
Number of cycles to failure (Coffin-Manson):
Δε_p = ε'_f × (2N_f)^c
Where Δε_p = plastic strain range = σ_range/E - ε_elastic_range
Design for thermal fatigue:
- Minimize CTE mismatch
- Add thermal expansion joints / bellows
- Use materials with high thermal fatigue resistance (low E×α product)
- Slow thermal cycling rate (creep relieves stress)
- Thermal barrier coatings
Creep at Elevated Temperature
Significant above T_homologous = T/T_melt > 0.4:
Steel: > ~400°C, Al: > ~150°C
Steady-state creep rate (Norton's law):
ε̇_ss = A × σⁿ × exp(-Q/RT)
n = 3-8 (metals), Q = activation energy, R = 8.314 J/(mol·K)
Larson-Miller parameter:
P = T × (C + log(t_r)) [T in Rankine or Kelvin, t_r in hours]
C ≈ 20-30 for many steels
Use P to find rupture time at given σ, or σ at given life from rupture curve
Stress relaxation (constant total strain, stress decreases):
σ(t) = σ₀/(1+(n-1)×A×σ₀^(n-1)×E×t)^(1/(n-1))
Common in bolted joints at temperature
Thermal Shock Resistance
Rapid ΔT → σ_surface = E × α × ΔT / (1-ν) (for thick body with restrained surface)
Thermal shock resistance parameter:
R = σ_f × (1-ν) / (E × α) [MPa·K or ksi·°F] — higher is better
Figure of merit for thermal shock:
R' = k × σ_f × (1-ν) / (E × α) [W/m] (with thermal conductivity — higher k = faster equalization)
| Material | R (MPa·K) |
|---|
| Si₃N₄ | 850 |
| SiC | 750 |
| ZrO₂ | 100 |
| Al₂O₃ | 70 |
| Steel | 60-90 |
| Aluminum | 500 |
| CFRP | 1500+ |
CTE Mismatch in Electronic/Structural Assemblies
Interface stress: σ_interface = E_avg × (α₁-α₂) × ΔT × L/(2h)
Where L = bond length, h = thickness
Peel stress (out-of-plane): σ_peel = 0.5×σ_shear
If |σ| > σ_adhesive → delamination
Common assembly mismatches:
PCB (FR4, α=17ppm) + copper trace (α=17ppm) — well matched
Ceramic substrate (α=6ppm) + solder (α=25ppm) — HIGH RISK
Steel housing (α=12ppm) + Invar insert (α=1.5ppm) — check joint
Output
Provide: σ_thermal [MPa/ksi], ΔL [mm/in], check vs. Sy at operating temperature, creep life if applicable, design recommendation (expansion joints, material change, coating).