Use when: Extracting technical information, identifying components, or making an initial inventory from hardware images (PCBs, circuit assemblies, teardowns). Generates structured visual observations and a component inventory table. Erste Bildsichtung, Bauteilerfassung aus Fotos, PCB-Bestandsaufnahme, Bauteil identifizieren aus Bild.
Standardmäßig ist der Prompt ausgewählt, der zuerst die Quelle prüft. Sie können zu einem direkten Befehl wechseln oder eine lokale Kopie herunterladen.
Quelldateien prüfen
Lesen Sie SKILL.md und alle von SkillsMP angezeigten Begleitdateien, bevor Sie sich für eine Installation entscheiden.
Mit Codex oder Claude installieren Kopieren Sie diesen Prompt, fügen Sie ihn in Codex, Claude oder einen anderen Assistant ein und lassen Sie die Skill-Seite prüfen und installieren.
Ein direkter Befehl überspringt den Prüf-Prompt. Prüfen Sie die Quelle, bevor Sie ihn ausführen.
Use when: Extracting technical information, identifying components, or making an initial inventory from hardware images (PCBs, circuit assemblies, teardowns). Generates structured visual observations and a component inventory table. Erste Bildsichtung, Bauteilerfassung aus Fotos, PCB-Bestandsaufnahme, Bauteil identifizieren aus Bild.
<skill_purpose>
Analyzes one or more hardware images and produces a structured technical baseline: what is visible, what components can be identified, and what remains uncertain. Typically Phase 1 of a fault diagnosis workflow.
</skill_purpose>
- One or more board images (front / back / detail shots)
- Optional: Known symptom or defect description for focused attention
1. Distinguish board sides (front / back / detail view) and label each observation accordingly.
2. Identify all visible components: connectors, switches, transistors, ICs, passives, motor terminals, charge ports.
3. Record visible markings exactly as they appear — do not interpret unclear markings, transcribe them literally.
4. Highlight larger discrete components and any visible damage (burn marks, cracked pads, lifted components, corrosion).
5. Mark areas that are unclear, obscured, low-resolution, or covered by solder mask as uncertain.
<output_format>
Create two files in the analysis/ folder (or the folder specified by the user).
Areas of uncertainty with reason (blur, angle, solder mask)
File 2 — Component Inventory (suggest filename: 02_component_inventory.md)
Table with columns: ID | Position | Visible Marking | Suspected Type | Suspected Function | Confidence
Example rows:
ID
Position
Visible Marking
Suspected Type
Suspected Function
Confidence
U1
Center-left, top side
"TP4056"
Li-Ion Charge IC
Battery charging control
High
Q1
Near motor connector
"S8050"
NPN BJT
Motor driver / load switch
Medium
J1
PCB edge, 2-pin
—
Battery connector
Power input
High
R3
Adjacent to U1
"102"
Resistor 1 kΩ
Current sense / bias
High
IC1
Top-right
"A3C" (partial)
Unknown SMD IC
Undetermined
Low
</output_format>
- Confidence levels: High = full marking readable and package matches expected type; Medium = partial marking or pattern match only; Low = package visible but marking illegible or ambiguous.
- When a marking is unclear, list multiple plausible interpretations rather than committing to one. Never assert definitive identification for an ambiguous marking.
- Record markings exactly as seen, including partial text, rotated characters, or single digits.
