sim-skills

Compare electronic component datasheets, BOM alternates, and replacement candidates for electrical engineering and sourcing decisions. Use when the user asks whether one chip, module, connector, passive, power device, sensor, IC, or PCB component can replace another; asks to compare datasheet PDFs, data sheets, spreadsheets, BOM rows, pinouts, packages, ratings, timing, electrical specs, thermal specs, or external-circuit requirements; or needs a source-backed replacement-risk table for EE review.

Search scholarly literature and research data through discoverable providers, including public metadata APIs, optional user-configured sources, legal open-access full-text discovery, identifier resolution, and citation/reference triage. Use when the user asks for paper search, topic or author literature discovery, DOI/arXiv/PMID/PMCID lookup, dataset DOI metadata, legal OA PDF or full-text locations, references, citations, related work, paper metadata, or evidence-backed literature triage.

Cross-solver discipline for reproducing simulation results from papers, reports, theses, benchmarks, or reference studies. Use with the relevant solver skill; this skill covers task framing, evidence, and staged acceptance rather than solver-specific commands.

Use when handling simulation requirement docs, 任务书/specs, client/lab/customer asks, vague modeling requests, paid gigs, or what should we actually deliver situations where the real decision, scope, missing inputs, validation evidence, or deliverable must be clarified before modeling.

Generate, preview, export, and sanity-check topology-aware 3D geometry before CAD or solver import. Use when users ask for text-to-geometry, parametric CAD, STEP/STL/mesh previews, geometry from sketches/images/papers/code, COMSOL/Fluent/Mechanical/Workbench/Abaqus geometry preflight, or fast iteration on dimensions, contacts, gaps, repeated cells, cavities, swept paths, porous structures, interlacing, membranes, or other geometry that should be checked before launching a heavy solver.