- name
- surface-analysis
- description
- Skill for surface composition, chemical state, and topography analysis including XPS depth profiling, AFM imaging, and contact angle measurements
- allowed-tools
- ["Read","Write","Glob","Grep","Bash"]
- metadata
- {"specialization":"materials-science","domain":"science","category":"materials-characterization","priority":"high","phase":6,"tools-libraries":["CasaXPS","Gwyddion","AFM analysis software","ImageJ"]}
- graph
- {"domains":["domain:materials-science"],"skillAreas":["skill-area:data-analysis","skill-area:statistical-analysis","skill-area:mathematical-reasoning"],"workflows":["workflow:experiment-design"],"roles":["role:research-engineer"]}
# Surface Analysis Skill
## Purpose
The Surface Analysis skill provides comprehensive capabilities for characterizing material surfaces, enabling detailed analysis of surface composition, chemical bonding states, topography, and interfacial properties critical for understanding surface-sensitive phenomena.
## Capabilities
- XPS depth profiling and chemical state analysis
- AFM imaging and roughness quantification
- Contact angle measurement and surface energy calculation
- Profilometry data analysis
- Surface contamination identification
- Tribological surface analysis
- Coating thickness measurement
- Adhesion mechanism analysis
## Usage Guidelines
### X-ray Photoelectron Spectroscopy (XPS)
1. **Survey Spectra**
- Acquire wide scan (0-1200 eV) for elemental identification
- Identify all elements present above detection limit (~0.1 at%)
- Note adventitious carbon for charge referencing
2. **High-Resolution Spectra**
- Acquire narrow scans for elements of interest
- Use appropriate pass energy (20-50 eV typical)
- Ensure sufficient signal-to-noise for peak fitting
3. **Peak Fitting**
- Apply Shirley or linear background
- Constrain FWHM and peak shape within physical limits
- Assign chemical states from binding energy shifts
4. **Depth Profiling**
- Use Ar+ sputtering for inorganic materials
- Consider cluster ions (Ar-cluster, C60) for organics
- Monitor for preferential sputtering and mixing
### Atomic Force Microscopy (AFM)
1. **Imaging Mode Selection**
- Contact mode: Hard surfaces, atomic resolution
- Tapping mode: Soft samples, reduced tip wear
- Non-contact: Minimal surface interaction
2. **Image Analysis**
- Calculate roughness parameters (Ra, RMS, Rmax)
- Identify surface features and defects
- Measure step heights and feature dimensions
3. **Force Spectroscopy**
- Acquire force-distance curves
- Extract adhesion forces
- Map mechanical properties (modulus, stiffness)
### Contact Angle Analysis
1. **Measurement Methods**
- Sessile drop for static contact angle
- Advancing/receding for dynamic behavior
- Wilhelmy plate for surface tension
2. **Surface Energy Calculation**
- Owens-Wendt method (dispersive + polar)
- Van Oss-Chaudhury-Good (acid-base)
- Use multiple probe liquids (water, diiodomethane, formamide)
3. **Interpretation**
- Hydrophilic: Contact angle < 90 degrees
- Hydrophobic: Contact angle > 90 degrees
- Superhydrophobic: Contact angle > 150 degrees
## Process Integration
- MS-003: Spectroscopic Analysis Suite
- MS-015: Thin Film Deposition Protocol
## Input Schema
```json
{
"sample_id": "string",
"technique": "XPS|AFM|contact_angle|profilometry",
"analysis_type": "survey|depth_profile|imaging|force_spectroscopy|wettability",
"parameters": {
"scan_area": "number (um x um for AFM)",
"sputter_depth": "number (nm for XPS)",
"probe_liquids": ["string (for contact angle)"]
}
}
```
## Output Schema
```json
{
"sample_id": "string",
"xps_results": {
"elemental_composition": [
{
"element": "string",
"concentration": "number (at%)",
"chemical_states": [
{
"state": "string",
"binding_energy": "number (eV)",
"fraction": "number (percent)"
}
]
}
],
"depth_profile": {
"depth": ["number (nm)"],
"composition": {}
}
},
"afm_results": {
"roughness": {
"Ra": "number (nm)",
"RMS": "number (nm)",
"Rmax": "number (nm)"
},
"features": ["string"]
},
"surface_energy": {
"total": "number (mJ/m2)",
"dispersive": "number (mJ/m2)",
"polar": "number (mJ/m2)"
}
}
```
## Best Practices
1. Clean samples appropriately before analysis (solvent, plasma)
2. Use charge neutralization for insulating samples in XPS
3. Reference XPS binding energies to C 1s at 284.8 eV
4. Calibrate AFM z-scale with step height standards
5. Use fresh probe liquids for contact angle measurements
6. Report measurement conditions and uncertainties
## Integration Points
- Connects with Spectroscopy Analysis for complementary chemical information
- Feeds into Thin Film Deposition for process monitoring
- Supports Failure Analysis for surface contamination identification
- Integrates with Corrosion Assessment for passive layer analysis
Voir sur GitHub