Materials Engineers

Architecture and Engineering Occupations · Job Skills & Competencies · SOC 17-2131 · 164 skills

Occupation context

These O*NET tasks describe the occupation. They provide context for this SOC mapping, but do not mean every listed Skill performs every task.

Analyze product failure data and laboratory test results to determine causes of problems and develop solutions.
Design and direct the testing or control of processing procedures.
Monitor material performance, and evaluate its deterioration.

O*NET task statements are shown in their source language (English). Task data excerpted from the O*NET® 29.1 Database (USDOL/ETA) and used under CC BY 4.0.

Representative sources

A bounded sample of popular skills mapped to this occupation, with at most one Skill from each GitHub repository. The complete mapped list follows.

corrosion-materials-selector

a5c-ai/babysitter

Materials selection skill for corrosion resistance based on process conditions and industry standards

acta-materialia

brycewang-stanford/Awesome-Journal-Skills

Use when targeting Acta Materialia or deciding whether a structural-materials / physical-metallurgy manuscript fits this venue. Encodes the journal's fit, the processing–structure–property–performance mechanism bar, characterization rigor, house style, the Acta-vs-Scripta and Acta-vs-functional-materials routing, official-submission re-check, and desk-reject heuristics.

calculate-titanium-sheet-weight

ECNU-ICALK/AutoSkill

Calculates the theoretical weight of a commercially pure titanium sheet (Grades 1-4) based on its dimensions to verify material authenticity.

semiconductor-process-master

swaylq/master-skill

半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗

All mapped skills

Browse the complete catalog mapping by repository popularity or latest source activity.

Skill names and descriptions remain in the language supplied by their source repository.

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corrosion-materials-selector

a5c-ai/babysitter

Materials selection skill for corrosion resistance based on process conditions and industry standards

failure-analysis

a5c-ai/babysitter

Systematic failure analysis methodology for mechanical component failures

material-selection

a5c-ai/babysitter

Systematic material selection using Ashby methodology and performance indices

acta-materialia

brycewang-stanford/Awesome-Journal-Skills

Use when targeting Acta Materialia or deciding whether a structural-materials / physical-metallurgy manuscript fits this venue. Encodes the journal's fit, the processing–structure–property–performance mechanism bar, characterization rigor, house style, the Acta-vs-Scripta and Acta-vs-functional-materials routing, official-submission re-check, and desk-reject heuristics.

progress-in-materials-science

brycewang-stanford/Awesome-Journal-Skills

Use when targeting Progress in Materials Science or deciding whether a materials-science review fits this venue. Encodes the journal's review-only fit, the comprehensiveness-and-critical-synthesis bar, the scope-and-balance expectations, the often-invited/proposal route, house style, official-submission re-check, and desk-reject heuristics.

calculate-titanium-sheet-weight

ECNU-ICALK/AutoSkill

Calculates the theoretical weight of a commercially pure titanium sheet (Grades 1-4) based on its dimensions to verify material authenticity.

semiconductor-process-master

swaylq/master-skill

半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗

iron-and-steel-processes

Tibsfox/gsd-skill-creator

Industrial production of iron and steel from ore to finished product — blast furnace, Bessemer converter, open-hearth, basic oxygen, electric arc, continuous casting, rolling, and secondary metallurgy. Covers the chemistry of decarburization, dephosphorization, and desulfurization, the metallurgy of plain carbon steels, the evolution from puddling and rolling to BOF and EAF, and the process-structure-property chain that makes mild steel the default structural material of the industrial era.

materials-characterization

Tibsfox/gsd-skill-creator

Measurement techniques for identifying composition, microstructure, and properties of engineering materials — optical and electron microscopy, x-ray diffraction, EDS and WDS spectroscopy, thermal analysis, mechanical testing, and fractography. Covers when to use which technique, sample-preparation pitfalls, and how to build a characterization plan that answers a specific engineering question rather than accumulating data for its own sake.

materials-selection

Tibsfox/gsd-skill-creator

Systematic materials selection for engineering design using performance indices, Ashby charts, multi-constraint optimization, and case-based reasoning. Covers the five-step Ashby method — function, objective, constraint, free variable, index — with worked examples for stiffness-limited beams, strength-limited ties, thermally shocked vessels, and minimum-cost components. Use when choosing among metals, polymers, ceramics, and composites under competing objectives.

nanomaterials-and-carbon

Tibsfox/gsd-skill-creator

Carbon allotropes and nanoscale materials — graphite, diamond, fullerenes (C60 and family), carbon nanotubes, graphene, and the broader class of low-dimensional materials. Covers synthesis routes (arc discharge, laser ablation, CVD, exfoliation), structural characterization, exceptional mechanical and electronic properties, and the gap between laboratory demonstrations and structural-scale applications.

nonferrous-alloys

Tibsfox/gsd-skill-creator

Metallurgy of the major nonferrous structural and engineering alloys — aluminum, copper, titanium, nickel, magnesium, and their strengthening mechanisms. Covers precipitation (age) hardening in Al-Cu and Al-Zn-Mg systems, solid-solution strengthening in brass and bronze, alpha-beta titanium, nickel superalloys with gamma-prime, and the trade-offs in density, strength, corrosion resistance, and cost that decide when to leave steel for a lighter or more specialized metal.